Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling - Université de Tours Accéder directement au contenu
Article Dans Une Revue Microelectronics Reliability Année : 2019

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

Fichier non déposé

Dates et versions

hal-02382376 , version 1 (27-11-2019)

Identifiants

Citer

Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. Microelectronics Reliability, 2019, 92, pp.20-26. ⟨10.1016/j.microrel.2018.11.005⟩. ⟨hal-02382376⟩
47 Consultations
0 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More