Journal Articles
Microelectronics Reliability
Year : 2019
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https://univ-tours.hal.science/hal-02382376
Submitted on : Wednesday, November 27, 2019-10:44:01 AM
Last modification on : Friday, March 24, 2023-2:53:14 PM
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- HAL Id : hal-02382376 , version 1
- DOI : 10.1016/j.microrel.2018.11.005
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Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. Microelectronics Reliability, 2019, 92, pp.20-26. ⟨10.1016/j.microrel.2018.11.005⟩. ⟨hal-02382376⟩
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